For most epoxy resins there is a correlation between the softening point and viscosity.  Low-viscosity epoxy resins become tacky or semi-solid at room temperature, which make them difficult to handle.
CER series combines bisphenol epoxy resins to create a semisolid state, which results in a resin with low viscosity and a high softening point.  CER series is currently being considered for a variety of applications, including semiconductor encapsulation materials which require handling in solid form during composition.